JPH0499829U - - Google Patents

Info

Publication number
JPH0499829U
JPH0499829U JP1991010385U JP1038591U JPH0499829U JP H0499829 U JPH0499829 U JP H0499829U JP 1991010385 U JP1991010385 U JP 1991010385U JP 1038591 U JP1038591 U JP 1038591U JP H0499829 U JPH0499829 U JP H0499829U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1991010385U
Other languages
Japanese (ja)
Other versions
JPH0710493Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1991010385U priority Critical patent/JPH0710493Y2/ja
Priority to EP92101374A priority patent/EP0499084A1/en
Priority to KR92001498U priority patent/KR950009001Y1/ko
Priority to US07/830,663 priority patent/US5248024A/en
Publication of JPH0499829U publication Critical patent/JPH0499829U/ja
Application granted granted Critical
Publication of JPH0710493Y2 publication Critical patent/JPH0710493Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP1991010385U 1991-02-05 1991-02-05 ウエーハ貼付板 Expired - Lifetime JPH0710493Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1991010385U JPH0710493Y2 (ja) 1991-02-05 1991-02-05 ウエーハ貼付板
EP92101374A EP0499084A1 (en) 1991-02-05 1992-01-28 Wafer mount plate
KR92001498U KR950009001Y1 (ko) 1991-02-05 1992-01-31 웨이퍼 부착판
US07/830,663 US5248024A (en) 1991-02-05 1992-02-04 Wafer mounting device having position indicator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991010385U JPH0710493Y2 (ja) 1991-02-05 1991-02-05 ウエーハ貼付板

Publications (2)

Publication Number Publication Date
JPH0499829U true JPH0499829U (en]) 1992-08-28
JPH0710493Y2 JPH0710493Y2 (ja) 1995-03-08

Family

ID=11748656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991010385U Expired - Lifetime JPH0710493Y2 (ja) 1991-02-05 1991-02-05 ウエーハ貼付板

Country Status (4)

Country Link
US (1) US5248024A (en])
EP (1) EP0499084A1 (en])
JP (1) JPH0710493Y2 (en])
KR (1) KR950009001Y1 (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205260A (ja) * 2001-01-09 2002-07-23 Fujikoshi Mach Corp ウェーハの貼付方法及びその装置
JP2009289882A (ja) * 2008-05-28 2009-12-10 Kyocera Corp キャリアプレートおよびこれを用いた研磨装置
JP2022099939A (ja) * 2020-12-23 2022-07-05 株式会社ディスコ 保持テーブル及び切削装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5975986A (en) * 1997-08-08 1999-11-02 Speedfam-Ipec Corporation Index table and drive mechanism for a chemical mechanical planarization machine
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US6367529B1 (en) 1998-05-01 2002-04-09 Fujikoshi Kikai Kogyo Kabushiki Kaisha Method of adhering wafers and wafer adhering device
US6411215B1 (en) * 1999-02-19 2002-06-25 J. Mitchell Shnier Optical methods for detecting the position or state of an object
JP4700819B2 (ja) 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
CN108818299B (zh) * 2018-06-06 2023-08-18 太仓鉴崧实业有限公司 一种交叉运转的磨盘结构及其工作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154149U (en]) * 1980-04-15 1981-11-18
JPS6072646A (ja) * 1983-09-29 1985-04-24 O C C:Kk 一方向凝固組織からなる金属成形体の水平連続鋳造法および装置
JPS6374267U (en]) * 1986-10-30 1988-05-18
JPH02295141A (ja) * 1989-05-09 1990-12-06 Nec Corp 配線基板及びそのワイヤボンディング方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054202A (en) * 1975-08-06 1977-10-18 Societe Anonyme Dite: Etude Et Realisation De Chaines Automatiques Erca Stepwise drive mechanism
CA1039319A (en) * 1976-02-14 1978-09-26 Kubota Ltd. Indication apparatus with discrete illuminated projections
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4412609A (en) * 1981-06-29 1983-11-01 Honeywell Information Systems Inc. Transport system
US4677604A (en) * 1985-02-04 1987-06-30 Selsys Corporation Method for controlling access to recorded data
US4744713A (en) * 1986-05-21 1988-05-17 Texas Instruments Incorporated Misalignment sensor for a wafer feeder assembly
US4787128A (en) * 1986-07-02 1988-11-29 J. L. Wickham Co. Modularly expandable integrated process machine system and rotary indexing mechanism therefor
US4819923A (en) * 1987-05-27 1989-04-11 Zumbusch Peter C Gearless indexing device
JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
EP0348757B1 (en) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Method for polishing a silicon wafer
JPH02110707A (ja) * 1988-10-20 1990-04-23 Fanuc Ltd リファレンス点復帰方式
US4936559A (en) * 1988-11-18 1990-06-26 Antonio Diaz Torga Indexing work-piece holder for numerically-controlled machine tools

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154149U (en]) * 1980-04-15 1981-11-18
JPS6072646A (ja) * 1983-09-29 1985-04-24 O C C:Kk 一方向凝固組織からなる金属成形体の水平連続鋳造法および装置
JPS6374267U (en]) * 1986-10-30 1988-05-18
JPH02295141A (ja) * 1989-05-09 1990-12-06 Nec Corp 配線基板及びそのワイヤボンディング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205260A (ja) * 2001-01-09 2002-07-23 Fujikoshi Mach Corp ウェーハの貼付方法及びその装置
JP2009289882A (ja) * 2008-05-28 2009-12-10 Kyocera Corp キャリアプレートおよびこれを用いた研磨装置
JP2022099939A (ja) * 2020-12-23 2022-07-05 株式会社ディスコ 保持テーブル及び切削装置

Also Published As

Publication number Publication date
US5248024A (en) 1993-09-28
EP0499084A1 (en) 1992-08-19
JPH0710493Y2 (ja) 1995-03-08
KR920017216U (ko) 1992-09-17
KR950009001Y1 (ko) 1995-10-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term